The rapid scaling of microprocessor technologies has led to unprecedented advancements in processing speed and transistor density. However, as device dimensions shrink below the nanometre scale, traditional electrical on-chip interconnects face critical limitations including increased signal delay, power consumption, and reduced bandwidth. These challenges have emerged as major bottlenecks in the performance and energy efficiency of modern microprocessors, especially in multi-core and many-core architectures.
To overcome these limitations, optical interconnects have gained significant attention as a high-performance alternative for on-chip and chip-to-chip communication. Optical interconnects offer key advantages such as higher data rates, lower latency, reduced power dissipation, and immunity to electromagnetic interference. The integration of optical components like waveguides, modulators, photodetectors, and silicon photonics within the chip architecture has the potential to revolutionize interconnect design by addressing the shortcomings of conventional electrical wiring.
This paper explores the evolution of on-chip interconnects, comparing the performance, scalability, and integration challenges of electrical and optical solutions in scaled microprocessors. It also discusses emerging hybrid interconnect architectures that combine the strengths of both technologies. A comparison is made between electrical and optical interconnects for different design criteria, based on projections about the future of optical devices. Around a tenth of the length of the chip's edge is the crucial dimension beyond which optical connectivity becomes preferable to electrical interconnect at the 22 nm technological node.